Test Capabilities
R&E uses only
qualified ISO certified sub-contractors for both wafer probe sorting, final
electrical evaluation, and Quality Assurance screening. The sub-contractors used
adhere to strict disciplines with respect to handling, testing and control of
all products manufactured for R&E.
Additionally; on August of 2007 , R&E
moved to our new facility with updated Test Area to provide new design
characterization as well as manufacturing support, yield analysis and quality
improvement test capabilities.
Test Area Highlights
- 1000sq. ft. of
conductive raised flooring
- Cleanroom
environment configuration
- Dedicated HVAC with
positive airflow HEPA filtering system
- Cleanroom
grade furniture
- ESD dissipative
furniture and operator apparel
- (1) ETS-300 Mixed Signal Test
System
- Fully populated (32)
Digital Channels
- (32) Analaog Channels – APU10
- SPU100
- TMU
- QMS – Quad
Measurement System
- PAM - Picoammeter
- (1) Sentry S20 Test System
- (1) 60Pin High Speed
Test head
- (1) 60Pin High Voltage
Test head
- IEEE Interface for
Mixed-Signal instrumentation add-ons
- (1) Sentry S10 Test System
- (2) 60Pin High Voltage
Test heads
- IEEE Interface for
Mixed-Signal instrumentation add-ons
- (2) Electroglas
2001X Automatic Wafer Probers
- 100, 125, or 150mm
wafer capability
- (2) Temptronic
Thermostreams
- -40C to +150C
temperature control for full operating range characterization
- (2) MCT 3616E handlers
Reliability Test
Qualified outside sub-contractors used.
R&E reliability requirements follow the MIL-STD-883
specification.